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1. product profile 1.1 general description 250 w ldmos power transistor for base st ation applications at frequencies from 1805 mhz to 1880 mhz. [1] test signal: 3gpp; test model 1;64 dpch; par = 8.4 db at 0.01% probability on ccdf. 1.2 features and benefits ? excellent ruggedness ? high-efficiency ? low r th providing excellent thermal stability ? designed for broadband operation (1805 mhz to 1880 mhz) ? lower output capacitance for improved performance in doherty applications ? designed for low memory effect s providing excellent digita l pre-distortion capability ? internally matched for ease of use ? integrated esd protection ? compliant to restriction of hazardous substances (rohs) directive 2002/95/ec 1.3 applications ? rf power amplifiers for w-cdma base statio ns and multicarrier applications in the 1805 mhz to 1880 mhz frequency range blf7g20l-250p; blf7g20ls-250p power ldmos transistor rev. 4 ? 12 july 2013 product data sheet table 1. typical performance typical rf performance at t case = 25 ? c in a common source class-ab production test circuit. mode of operation f i dq v ds p l(av) g p ? d acpr (mhz) (ma) (v) (w) (db) (%) (dbc) 2-carrier w-cdma 1805 to 1880 1900 28 70 18 35 ? 29.5 [1]
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 2 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 2. pinning information [1] connected to flange. 3. ordering information 4. limiting values table 2. pinning pin description simplified outline graphic symbol blf7g20l-250p (sot539a) 1drain1 2drain2 3gate1 4gate2 5source [1] blf7g20ls-250p (sot539b) 1drain1 2drain2 3gate1 4gate2 5source [1] 5 12 43 4 3 5 1 2 sym117 5 12 43 4 3 5 1 2 sym117 table 3. ordering information type number package name description version blf7g20l-250p - flanged balanced ldmost ceramic package; 2 mounting holes; 4 leads sot539a blf7g20ls-250p - earless flanged balanced ldmost ceramic package; 4 leads sot539b table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage - 65 v v gs gate-source voltage ? 0.5 +13 v i d drain current - 65 a t stg storage temperature ? 65 +150 ?c t j junction temperature - 200 ?c
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 3 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 5. thermal characteristics 6. characteristics 7. test information 7.1 ruggedness in class-ab operation the blf7g20l-250p and blf7g20ls-250p are capable of withstanding a load mismatch corresponding to a vswr = 10 : 1 through all phases under the following conditions: v ds =28v; i dq = 1900 ma; p l(1db) = 245 w (cw); f = 1805 mhz to 1880 mhz. table 5. thermal characteristics symbol parameter conditions typ unit r th(j-c) thermal resistance from junction to case t case =80 ? c; p l =70w; v ds =28v; i dq = 1900 ma; t j ? 150 ?c 0.20 k/w table 6. characteristics t j = 25 ? c unless otherwise specified. symbol parameter conditions min typ max unit v (br)dss drain-source breakdown voltage v gs =0v; i d =1.5ma 65 - - v v gs(th) gate-source threshold voltage v ds =10 v; i d = 150 ma 1.5 1.78 2.3 v i dss drain leakage current v gs =0v; v ds =28v--2.8 ? a i dsx drain cut-off current v gs =v gs(th) +3.75 v; v ds =10v - 33.4 37.54 a i gss gate leakage current v gs =11v; v ds =0v - 68.3 - na g fs forward transconductance v ds =10v; i d = 7.5 a - 12.37 - s r ds(on) drain-source on-state resistance v gs =v gs(th) + 3.75 v; i d =5.25a - 0.078 0.135 ? table 7. 2-carrier w-cdma fu nctional test information class-ab production test circuit; par = 8. 4 db at 0.01 % probability on the ccdf; 3gpp test model 1; 64 dpch; f = 1805 mhz to 1880 mhz; rf performance at v ds =28v; i dq = 1900 ma; t case =25 ? c; unless otherwise specified. symbol parameter conditions min typ max unit p l(av) average output power - 70 - w g p power gain p l(av) =70w 16 18 - db rl in input return loss p l(av) =70w - ? 12 - db ? d drain efficiency p l(av) =70w 30 35 - % acpr adjacent channel power ratio p l(av) =70w - ? 29.5 ? 24.5 dbc
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 4 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 7.2 impedance information [1] z s and z l defined in figure 1 . table 8. typical impedance measured load-pull data half device; i dq = 950 ma; v ds = 28 v. f z s [1] z l [1] (mhz) (? ) (? ) 1750 1.31 ? j3.53 2.47 ? j3.91 1805 1.39 ? j3.75 2.27 ? j3.63 1845 1.48 ? j4.10 2.32 ? j3.19 1880 1.55 ? j4.19 1.89 ? j3.15 1930 1.97 ? j4.48 1.70 ? j2.95 fig 1. definition of transistor impedance 001aaf059 drain z l z s gate
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 5 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 7.3 single carrier w-cdma 3gpp; test model 1; 64 dpch; par = 7.2 db at 0.01 % probabilit y on ccdf. channel bandwidth is 3.84 mhz; channel spacing = 5 mhz; v ds = 28 v; i dq = 1900 ma (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. fig 2. peak-to-average power ratio as a function of peak output power; typical values fig 3. adjacent channel power ratio (5 mhz) as a function of average output power; typical values 001aal942 p l(m) (w) 50 350 250 150 4 2 6 8 par (db) 0 (1) (2) (3) p l(av) (w) 0 120 80 40 001aal943 -40 -20 0 acpr 5m (dbc) -60 (1) (2) (3) (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. fig 4. efficiency as a function of average output power; typical values fig 5. power gain and drain efficiency as a function of average output power; typical values p l(av) (w) 0 300 200 100 001aal950 20 40 60
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 6 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 7.4 one tone cw v ds = 28 v; i dq = 1900 ma. (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. fig 6. power gain as a function of average output power; typical values fig 7. efficiency as a function of average output power; typical values 001aal949 p l(av) (w) 0 300 200 100 16 17 15 18 19 g p (db) 14 (1) (2) (3) p l(av) (w) 0 140120 40 80 100 20 60 001aal947 20 30 10 40 50 d (%) 0 (1) (2) (3)
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 7 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 7.5 2-carrier wcdma characteristics v ds = 28 v; i dq = 1900 ma; channel spacing = 5 mhz; par = 8.4 db at 0.01 % probability on the ccdf. (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. fig 8. power gain as a function of average output power; typical values fig 9. efficiency as a function of average output power; typical values p l(av) (w) 0 140120 40 80 100 20 60 001aal946 17.0 17.5 16.5 18.0 18.5 g p (db) 16.0 (1) (2) (3) p l(av) (w) 0 140120 40 80 100 20 60 001aal947 20 30 10 40 50 d (%) 0 (1) (2) (3) (1) f = 1805 mhz. (2) f = 1845 mhz. (3) f = 1880 mhz. fig 10. average power gain and drain efficiency as a function of average output power; typical values fig 11. adjacent channel power ratio (5 mhz) as a function of average output power; typical values 001aam087 p l(av) (w) 10 130 90 50 17.0 17.5 16.5 18.0 18.5 g p (db) 16.0 20 30 10 40 50 d (%) 0 g p d p l(av) (w) 0 40 80 120 140 100 60 20 001aal948 -40 -20 0 acpr 5m (dbc) -60 (1) (2) (3)
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 8 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 7.6 test circuit [1] see mechanical drawing ( figure 12 ). table 9. list of components for test circuit see figure 12 . component description value code number type remarks base plate [1] c3, c4, c9, c10 multi layer ceramic chip capacitor 47 pf atc 800b mount on edge c5 multi layer ceramic chip capacitor 1.2 pf atc 800b mount on edge c6, c7 chip capacitor 560 pf atc 100a c8 multi layer ceramic chip capacitor 68 pf atc 800b mount on edge c11, c12 multi layer ce ramic chip capacitor 10 ? ft d k c13 electrolytic capacitor 470 ? f; 63 v c15, c16 multi layer ceramic chip capacitor 100 nf phillips 1206 r2, r3 chip resistor 10 ? philips 0603 printed-circuit board (pcb): taconic rf35; ? r = 3.5 f/m; thickness = 0.76 mm; thickness copper plating = 35 ? m see table 9 for a list of components. fig 12. component layout for class-ab production test circuit 001aam088 r3 c6 c16 r2 c3 c9 c12 c8 c11 c10 c15 c13 c7 c5 c4 nxp blf7g20l-250p input rev 03 nxp blf7g20l-250p output rev 03
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 9 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 8. package outline fig 13. package outline sot539a references outline version european projection issue date iec jedec eiaj sot539a 12-05-02 10-02-02 0 5 10 mm scale p a f b e d u 2 l h q c 5 12 4 3 d 1 e a w 1 ab m m m q u 1 h 1 c b m m w 2 c e 1 m w 3 unit a mm d b 11.81 11.56 0.18 0.10 31.55 30.94 13.72 9.53 9.27 17.12 16.10 10.29 10.03 4.7 4.2 c e u 2 0.25 0.25 0.51 w 3 35.56 qw 2 w 1 f 1.75 1.50 u 1 41.28 41.02 h 1 25.53 25.27 p 3.30 3.05 q 2.26 2.01 ee 1 9.50 9.30 inches 0.465 0.455 0.007 0.004 1.242 1.218 d 1 31.52 30.96 1.241 1.219 0.540 0.375 0.365 0.674 0.634 0.405 0.395 0.185 0.165 0.010 0.010 0.020 1.400 0.069 0.059 1.625 1.615 1.005 0.995 0.130 0.120 0.089 0.079 0.374 0.366 h 3.48 2.97 0.137 0.117 l dimensions (millimetre dimensions are derived from the original inch dimensions) flanged balanced ceramic package; 2 mounting holes; 4 leads sot539a note 1. millimeter dimensions are derived from the original inch dimensions. 2. recommended screw pitch dimension of 1.52 inch (38.6 mm) based on m3 screw.
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 10 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor fig 14. package outline sot539b references outline version european projection issue date iec jedec jeita sot539b sot539b_po 12-05-02 13-05-24 unit (1) mm max nom min 4.7 4.2 11.81 11.56 31.55 30.94 31.52 30.96 9.5 9.3 9.53 9.27 1.75 1.50 17.12 16.10 3.48 2.97 10.29 10.03 0.25 a dimensions earless flanged balanced ceramic package; 4 leads sot539b bc 0.18 0.10 dd 1 ee 1 e 13.72 fhh 1 25.53 25.27 lq 2.26 2.01 u 1 32.39 32.13 u 2 w 2 0.25 inches max nom min 0.185 0.165 0.465 0.455 1.242 1.218 1.241 1.219 0.374 0.366 0.375 0.365 0.069 0.059 0.674 0.634 0.137 0.117 0.405 0.395 0.01 0.007 0.004 0.54 1.005 0.995 0.089 0.079 1.275 1.265 0.01 w 3 0 5 10 mm scale c e q e 1 e h l b h 1 u 1 u 2 d w 2 w 3 1 2 3 4 d d a f d 1 5 note 1. millimeter dimensions are derived from the original inch dimensions.
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 11 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 9. handling information 10. abbreviations caution this device is sensitive to electrostatic di scharge (esd). observe precautions for handling electrostatic sensitive devices. such precautions are described in the ansi/esd s20.20 , iec/st 61340-5 , jesd625-a or equivalent standards. table 10. abbreviations acronym description 3gpp third generation partnership project ccdf complementary cumulative distribution function cw continuous wave dpch dedicated physical channel esd electrostatic discharge ldmos laterally diffused metal-oxide semiconductor ldmost laterally diffused metal-oxide semiconductor transistor par peak-to-average power ratio vswr voltage standing wave ratio w-cdma wideband code division multiple access
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 12 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 11. revision history table 11. revision history document id release date data sheet status change notice supersedes blf7g20l-250p_7g20ls-250p v.4 20130712 product data sheet - blf7g20l-250p_7g20ls-250p v.3 modifications: ? the package outline figure 14 is updated. ? translation disclaimer added to the legal text. blf7g20l-250p_7g20ls-250p v.3 20110103 produc t data sheet - blf7g20l-250p_7g20ls-250p v.2 modifications: ? data sheet status changed from prel iminary sheet to product data sheet ? table 1 on page 1: pdpch has been changed to dpch ? section 1.1 on page 1: caution about esd has been moved to section 9 on page 11 ? table 4 on page 2: i d value has been added. ? table 7 on page 3: pdpch has been changed to dpch ? section 7.2 on page 4: section has been added ? figure 5 on page 5: redundant conditions about frequency have been removed ? table 9 on page 8: title of table has been changed ? table 9 on page 8: redundant information has been removed ? section 9 on page 11: section has been added. blf7g20l-250p_7g20ls-250p v.2 20100909 prelimina ry data sheet - blf7g20l-250p_7g20ls-250p v.1 blf7g20l-250p_7g20ls-250p v.1 20091216 objective data sheet - -
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 13 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
blf7g20l-250p_7g20ls-250p all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 4 ? 12 july 2013 14 of 15 nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors blf7g20l-250p; blf7g20ls-250p power ldmos transistor ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 12 july 2013 document identifier: blf7g20l-250p_7g20ls-250p please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 thermal characteristics . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 test information . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.1 ruggedness in class-ab operation . . . . . . . . . 3 7.2 impedance information . . . . . . . . . . . . . . . . . . . 4 7.3 single carrier w-cdma . . . . . . . . . . . . . . . . . . 5 7.4 one tone cw . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.5 2-carrier wcdma characteristics . . . . . . . . . . . 7 7.6 test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 handling information. . . . . . . . . . . . . . . . . . . . 11 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 contact information. . . . . . . . . . . . . . . . . . . . . 14 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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